Non Invasive Measurement
Non-Ionizing Radiation
Non-Contact Testing
Real-Time Results
Best in Industries
Aerospace
Automotive
Energy Industries
Composites Inspection
TeraNIM™ can inspect various composite materials.
- Internal and External Defect detection
- De-bond and Delamination
- Moisture Detection
- Material Density
- Foams and Plastic subsurface defects
Coatings Measurement
TeraNIM™ can test di-electric materials and measure
- Coating Thickness
- Thermal Barrier coating
- Multi-layer coatings measurement
- Corrosion or Damage under coatings.
- Layer adhesion or delamination volumes
Energy Segment Applications
TeraNIM™ is addressing following challenges
- GFRP Sub-surface and Bonding Inspection
- In-Line Quality Control of Lithium-Ion Battery Electrodes
- Plastic weld inspection
Integrated PC and software package for real-time measurement and data analysis
- Dielectric properties and material characteristics can be measured.
- Obtain both time domain and frequency domain signal.
- Both spectroscopy and imaging measurements.
- Automated motorized stages for imaging.
Multi-Layer Measurement
- All Dielectric materials can be measured
- Measure thickness of each layer individually
- Compact and mobile
Efficacious and Accurate
- Real Time Measurement
- Non-Contact Measurement
- Accuracy with 0.1μm
User-Friendly Integration
- Offline system
- In-line system
- Auto Data saving and report generation
Safety First
- Terahertz waves are harmless to humans
- No protection required
- No moving parts
Terahertz Specification
| Spectral Range | 0.1 – 3.5 THz |
|---|---|
|
Dynamic Range |
> 50 dB |
|
Average Power |
100μW |
|
Total Scan Range |
> 330ps |
|
Scan Speed |
> 5ps/s |
|
THZ Frequency Resolution |
< 1.2GHz |
|
Laser Outputs Ports |
1550 nm, FC/APC, PM fibre |
Imaging Specification
| Travel Range | 75 mm x 75 mm x 75 mm ( customizable ) |
|---|---|
|
Resolution X - Axis |
< 250 μm* ( Stage resolution < 10 μm ) |
|
Resolution Y - Axis |
< 250 μm* ( Stage resolution < 10 μm ) |
|
Resolution Z - Axis |
Stage resolution < 10 μm |
|
Speed |
10 mm/sec |
|
Sensor Integration |
Camera / Depth Sensor / Laser |
Note: Turnkey system is customizable based on application requirements.
